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Frequently asked questions
Memory speed in servers and workstations primarily depends on the processor (CPU) model configured, the chipset and the number memory modules installed per channel Intel and AMD create specific guidelines for each of their chipsets and processors, so it’s important to follow their memory population rules to maximize bandwidth and performance.
A CPU may only be able to run memory up to a certain speed. For example, installing DDR5 6400MT/s RDIMMs in combination with processor(s) that can only run memory at 5600MT/s will result in the memory downclocking to 5600MT/s. Sometimes the modules will be forced to operate at even slower speeds, depending on the population rules outlined by the CPU manufacturer.
Just as important as the processor model, the type of motherboard and chipset will determine how fast the installed memory modules will run. A chipset manages the data shared between CPU, memory, storage, graphics, and other integral components. Each chipset is designed to operate memory at specific industry standard speeds. Occasionally Intel and AMD introduce new generations of processors that can be installed in previous generation chipsets. Due to chipset limitations, this may mean that the memory speed is limited to operate at lower speeds. Refer to the system manufacturer or motherboard manual for assistance with setting up the proper memory configurations.
FAQ: KTM-060415-SVR-01
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Registered DIMMs (RDIMMs) are a specific type of memory used by most servers and workstations. Having a Register component, also known as a Registered Clock Driver (RCD), is essential for servers and high-end desktop platforms to reach high speeds and capacities. It’s used as a buffer to properly manage data being processed between DRAM and the CPU. RDIMMs have more DRAM chips equipped per module to support ECC, required to ensure system stability and high performance during heavy workloads.
ECC (Error Correction Code) refers to an algorithm that can detect and correct single or multiple bit data corruption in computing. For memory (RAM), ECC is featured in the memory controller of server or workstation class processors. ECC memory modules feature additional DRAM components to provide extra data width required for the memory controller to perform error detection and correction. For DDR3 and DDR4, 72-bit (x72) modules support ECC, while for DDR5 both 72-bit (x72 or EC4) and 80-bit (x80 or EC8) both support ECC.
Unbuffered memory modules do not feature additional buffers or registers and are primarily used in desktops and mobile systems. For DDR5, DDR4, and DDR3, these modules are 64-bits wide, which indicates they are non-ECC, or lack the extra DRAM to support the ECC function. However, unbuffered modules can be built with extra DRAM (72-bit) to support the ECC function and would be called ECC Unbuffered DIMMs or ECC SODIMMs.
FAQ: KTM-012711-GEN-03
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No. Registered and Unbuffered RAM can't coexist. Registered and Unbuffered are two different memory technologies. Installing the incorrect memory or mixing these technologies could cause damage to the motherboard and/or memory module(s).
FAQ: KTM-021011-GEN-15
FAQ: KTM-021011-GEN-15
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Parts sold in kits (denoted by "K2," "K4" or “K8” in the part number e.g., KF572RH38RBK8-256) are packaged for use in dual, quad, or octal channel configurations. The desktops workstations, and laptops that support these configurations are designed to access multiple identical memory modules, aggregating their bandwidth for more performance. Kingston ensures that only modules with matching components are packaged into dual (K2), quad (K4), and octal (K8) channel kits. Single modules purchased at different times may feature different components. While it’s unlikely to cause any performance or compatibility issues, it’s recommended to always buy kits for multi-channel systems to all components are the same.
FAQ: KTM-020911-GEN-19
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A memory rank is a 64-bit wide data block on a memory module. Single, dual, quad, and octal rank modules are single physical modules with one or multiple 64-bit wide data blocks. These are denoted as 1R, 2R, 4R, and 8R.
FAQ: KTM-021011-KVR-02
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Electrostatic Discharge (ESD) is the discharge of built-up static electricity. ESD should not be taken lightly as this is one of the few things an individual can do to damage or destroy their electronic components.
Static electricity occurs naturally because of friction, such as when walking barefoot on carpet on a dry, windy day. When static build up occurs on a body it will discharge when in contact with a conductive surface, like metal. This includes conductive electrical components like memory modules. A discharge of ESD onto a memory module may go unnoticed when installing into a PC, but the charge introduced may cause serious damage to the circuits. The damage may be immediate, or manifest overtime.
How to prevent ESD
The best method of preventing ESD is to ground yourself before handling electronics. You can also use ESD protective equipment, such as an ESD wrist strap or a grounding mat to reduce the chances of ESD. The following steps below will also help reduce the chance of ESD:
Standing – It’s recommended to stand when working with components inside a computer. When sitting in a chair, it’s common for people to lift their feet off the floor, which removes the path to grounding for ESD.
Cords - Ensure all cords are removed from the back of the computer (power cord, mouse, keyboard, etc.).
Clothing – Do not wear fabrics that are more likely to build up ESD, such as a wool sweater.
Accessories - To help reduce ESD and help prevent other problems, it is also good practice to remove all jewelry.
Weather - Electrical storms can increase the ESD risk; unless necessary, try not to work on a computer during an electrical storm. Very dry areas and wind also contribute to electrostatic build-up
To learn more about ESD and how to protect your electronics, please visit the ESD Association website
FAQ: KTC-Gen-ESD
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No. Registered and Unbuffered RAM can't coexist. Registered and Unbuffered are two different memory technologies. Installing the incorrect memory or mixing these technologies could cause damage to the motherboard and/or memory module(s).
FAQ: KTM-021011-GEN-15
FAQ: KTM-021011-GEN-15
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FAQ: KTF-001002-002
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On servers, mixing within a multi-channel bank group is not permitted. If adding memory to the second bank group, it is always recommended to put the higher capacity memory in the first bank.
Mixing memory modules or kits in a PC/laptop using overclockable memory (Kingston FURY) is never supported.
FAQ: KTF-001002-003
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Registered DIMMs (RDIMMs) are a specific type of memory used by most servers and workstations. Having a Register component, also known as a Registered Clock Driver (RCD), is essential for servers and high-end desktop platforms to reach high speeds and capacities. It’s used as a buffer to properly manage data being processed between DRAM and the CPU. RDIMMs have more DRAM chips equipped per module to support ECC, required to ensure system stability and high performance during heavy workloads.
ECC (Error Correction Code) refers to an algorithm that can detect and correct single or multiple bit data corruption in computing. For memory (RAM), ECC is featured in the memory controller of server or workstation class processors. ECC memory modules feature additional DRAM components to provide extra data width required for the memory controller to perform error detection and correction. For DDR3 and DDR4, 72-bit (x72) modules support ECC, while for DDR5 both 72-bit (x72 or EC4) and 80-bit (x80 or EC8) both support ECC.
Unbuffered memory modules do not feature additional buffers or registers and are primarily used in desktops and mobile systems. For DDR5, DDR4, and DDR3, these modules are 64-bits wide, which indicates they are non-ECC, or lack the extra DRAM to support the ECC function. However, unbuffered modules can be built with extra DRAM (72-bit) to support the ECC function and would be called ECC Unbuffered DIMMs or ECC SODIMMs.
FAQ: KTM-012711-GEN-03
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Parts sold in kits (denoted by "K2," "K4" or “K8” in the part number e.g., KF572RH38RBK8-256) are packaged for use in dual, quad, or octal channel configurations. The desktops workstations, and laptops that support these configurations are designed to access multiple identical memory modules, aggregating their bandwidth for more performance. Kingston ensures that only modules with matching components are packaged into dual (K2), quad (K4), and octal (K8) channel kits. Single modules purchased at different times may feature different components. While it’s unlikely to cause any performance or compatibility issues, it’s recommended to always buy kits for multi-channel systems to all components are the same.
FAQ: KTM-020911-GEN-19
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A memory rank is a 64-bit wide data block on a memory module. Single, dual, quad, and octal rank modules are single physical modules with one or multiple 64-bit wide data blocks. These are denoted as 1R, 2R, 4R, and 8R.
FAQ: KTM-021011-KVR-02
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32Gbit DRAM refers to memory chips with a density of 32 gigabits (Gb). These are planar (non-stacked) chips, that enable high-capacity modules without the use of 3D stacking technologies like Through-Silicon Via (TSV) or Dual-Die Package (DDP). Instead, DRAM semiconductor manufacturers use advanced lithography techniques to fit more memory cells into the same physical chip area. Compared to earlier 16Gbit or 24Gbit DDR5 chips, 32Gbit DRAM significantly increases the capacity of memory modules. This allows systems to support higher memory capacities using the same form factor, helping reduce reliance on more complex and expensive stacked DRAM solutions. 32Gbit-based memory modules are compatible with most Intel and AMD systems, but a BIOS upgrade may be required. Check with the Kingston Configurator to see which systems are confirmed compatible.
FAQ: KTF-001002-006
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Electrostatic Discharge (ESD) is the discharge of built-up static electricity. ESD should not be taken lightly as this is one of the few things an individual can do to damage or destroy their electronic components.
Static electricity occurs naturally because of friction, such as when walking barefoot on carpet on a dry, windy day. When static build up occurs on a body it will discharge when in contact with a conductive surface, like metal. This includes conductive electrical components like memory modules. A discharge of ESD onto a memory module may go unnoticed when installing into a PC, but the charge introduced may cause serious damage to the circuits. The damage may be immediate, or manifest overtime.
How to prevent ESD
The best method of preventing ESD is to ground yourself before handling electronics. You can also use ESD protective equipment, such as an ESD wrist strap or a grounding mat to reduce the chances of ESD. The following steps below will also help reduce the chance of ESD:
Standing – It’s recommended to stand when working with components inside a computer. When sitting in a chair, it’s common for people to lift their feet off the floor, which removes the path to grounding for ESD.
Cords - Ensure all cords are removed from the back of the computer (power cord, mouse, keyboard, etc.).
Clothing – Do not wear fabrics that are more likely to build up ESD, such as a wool sweater.
Accessories - To help reduce ESD and help prevent other problems, it is also good practice to remove all jewelry.
Weather - Electrical storms can increase the ESD risk; unless necessary, try not to work on a computer during an electrical storm. Very dry areas and wind also contribute to electrostatic build-up
To learn more about ESD and how to protect your electronics, please visit the ESD Association website
FAQ: KTC-Gen-ESD
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To increase the density, DRAM semiconductor manufacturers must continually improve their design and shrink the silicon wafer process (measured in nanometers or nm) to increase the number of memory cells, generally within the same package (chip) footprint as the previous generation. By doing this, the same JEDEC PCB (Printed Circuit Board) designs for memory modules can be utilized.
FAQ: KTF-001002-001
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Memory speed in servers and workstations primarily depends on the processor (CPU) model configured, the chipset and the number memory modules installed per channel Intel and AMD create specific guidelines for each of their chipsets and processors, so it’s important to follow their memory population rules to maximize bandwidth and performance.
A CPU may only be able to run memory up to a certain speed. For example, installing DDR5 6400MT/s RDIMMs in combination with processor(s) that can only run memory at 5600MT/s will result in the memory downclocking to 5600MT/s. Sometimes the modules will be forced to operate at even slower speeds, depending on the population rules outlined by the CPU manufacturer.
Just as important as the processor model, the type of motherboard and chipset will determine how fast the installed memory modules will run. A chipset manages the data shared between CPU, memory, storage, graphics, and other integral components. Each chipset is designed to operate memory at specific industry standard speeds. Occasionally Intel and AMD introduce new generations of processors that can be installed in previous generation chipsets. Due to chipset limitations, this may mean that the memory speed is limited to operate at lower speeds. Refer to the system manufacturer or motherboard manual for assistance with setting up the proper memory configurations.
FAQ: KTM-060415-SVR-01
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When booting a DDR5 system for the first time, when the memory configuration has changed, or when the BIOS/firmware has been updated, a process called memory training is initiated during POST (Power-On Self-Test). Some DDR5 PCs may take 3-5 minutes to complete training, while some DDR5 server/workstation systems may take up 15 minutes to complete. This is often mistaken for a system freeze or problem, especially if the screen remains blank. If there is a memory error or other issue, these are typically indicated by LED lights or codes on the motherboard, or an error reported on the screen. If there is no such error, it’s important to let the system complete memory training.
Memory training is a critically important step for DDR5, which requires optimization between the memory controller, BIOS, and DRAM components. Failure to do so can cause instability or performance issues. Once training is complete, all subsequent boots are significantly shorter. We do not recommend changing settings to bypass training in any way. Training time can vary depending on the amount of RAM installed. More installed RAM capacity usually means a longer memory training period.
When memory training is complete, the system will either reboot or proceed to the operating system.
FAQ: KTM-012711-GEN-20
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