Dell/Alienware - PowerEdge M710 / M710HD

configurator results memory

표준

4 GB (Removable)
최대

96 GB ECC UDIMMs

288 GB Reg ECC RDIMMs using 2 CPUs

384 GB using twelve 32GB Quad Rank RDIMMs

Reg ECC RDIMMs:

CPU 1:

CPU 2:

ECC UDIMMs or Quad-Rank RDIMM:

CPU 1:

CPU 2:

버스 아키텍처

USB 2.0/3.x Type-A

PCI-X

PCI Express

SSD - SATA 2.5-inch 9.5mm

호환 스토리지 업그레이드

12 Socket(s) maximum using UDIMMs or QR RDIMMs

18 Socket(s) maximum using RDIMMs

Intel Xeon 5600 series Intel 5520

Intel Xeon 5500 series Intel 5520

Kingston offers "K3" kit part numbers for Triple Channel mode.
Kingston's DDR3-1333 modules automatically clock down to 1066MHz and 800MHz depending on which Intel Xeon model is installed and how many module banks are populated.
Due to chipset limitations, DDR3 Quad Rank memory will operate at 1066MHz in the first Triple Channel bank. Adding Quad Rank modules in the second Triple Channel bank will operate at 800MHz. The third memory bank must be unpopulated.
This system supports either Registered ECC or Unbuffered ECC memory. Mixing Registered ECC and Unbuffered ECC modules is not supported within this system.

Due to chipset limitations, Unbuffered ECC DIMMs are limited to TWO Triple Channel banks per processor on Intel Xeon 55xx series systems.
RAS features (ie, Mirror mode, Advanced ECC mode) require memory installed in pairs or two channels only, the third channel is disabled. On 18 socket boards, Mirror Mode or Advanced ECC mode require Single and Dual Rank RDIMMs to achieve 3 DIMMs Per Channel (6 total). Using Quad Rank and ECC UDIMMs up to 2 DIMMs Per Channel (4 total).
4GB DDR3-1333 Reg ECC modules come in two versions: 313S/4G using x4 and 3138/4G using x8 DRAM. The two parts may be installed in the same system but not within the same memory bank. Use like modules for dual and triple channel operation.
DDR3L 1.35V low voltage memory is supported on Xeon 5600 series or newer processors depending on model number.

* Kits: warranty void and returns not accepted if sold or used separately.