Pamięć do HP/HPE - Workstation Z800

Standard

4 GB (Removable)

6 GB (Removable)

12 GB (Removable)
Maksymalna liczba

48 GB ECC UDIMM

192 GB RDIMM

CPU 1:

CPU 2:

Architektura magistrali

USB 2.0/3.x Type-A

SSD - SATA 2.5-inch 9.5mm

Kompatybilne urządzenia pamięci masowej do modernizacji

6 Socket(s) per CPU

12 Socket(s) using two CPU's

Intel Xeon 5600 Series Intel 5520

Intel Xeon 5500 Series Intel 5520

FF825AV; FG639EC; FL848UA; FL849UA; FL850UA; FL851UA; FL875UT; FL876UT; FL877UT; FL878UT; FL879UT; FL881UT; FX465AV; KK533EA; KK543EA; KK544EA; KK561EA; KK562ET; KK563EA; KK564ET; KK577EA; KK584ET; KK599ET; KK600ET; KK604EA; KK629EA; KK644EA; KK658ET; KK659ET; VA789UA

Kingston offers "K3" kit part numbers for Triple Channel mode.
Faster memory will clock down to run at optimal speed and voltage depending on processor model and number of modules installed.
DDR3L 1.35V low voltage memory is supported on Xeon 5600 series or newer processors depending on model number.
DDR3 1333MHz speed requires Intel Xeon X5550 or higher processors. 1066MHz requires Xeon E5520 or higher, Xeon E5506 or lower support 800MHz only. Memory speed will be reduced as the number of modules installed increases. 1333MHz is supported with one DIMM per channel only using Xeon X55xx series.

Due to chipset limitations, Kingston's DDR3 Quad Rank memory will operate at 1066MHz in the first Triple Channel bank. Adding Quad Rank modules in the second Triple Channel bank will operate at 800MHz.
This system supports either Registered ECC or Unbuffered ECC memory. Mixing Registered ECC and Unbuffered ECC modules is not supported within this system.
4GB DDR3-1333 Reg ECC modules come in two versions: 313/4G using x4 and 3138/4G using x8 DRAM. The two parts may be installed in the same system but not within the same memory bank. Use like modules for dual and triple channel operation.