HP/HPE - ProLiant WS460c Gen8 (G8)
![configurator results memory](https://media.kingston.com/kingston/headers/ktc-configurator-results-memory-md.jpg)
-
Standard
8 GB (Removable)
-
Massimo
128 GB ECC UDIMMs
256 GB RDIMMs
512 GB LRDIMMs
-
8GB Standard:
Processor 1 (installed):
4 GB4 GB -
Processor 2 (optional):
-
Architettura bus
PCI-X
PCI Express
SSD - SATA 2.5-inch 9.5mm
-
16 Socket(s) using two processors
8 Socket(s) per processor
-
Intel Xeon E5-2600 Series Intel C600 Series
678275-B21; 678276-B21
Note importanti sulla configurazione
- This system supports Registered ECC (RDIMM) or Unbuffered ECC (ECC UDIMM) or Load Reduced (LRDIMM) memory. Mixing RDIMM, ECC UDIMM and LRDIMM is not supported within this system.
- If only one processor is installed, only 8 DIMM slots are available. When populating with two processors 16 DIMM slots are available.
- White DIMM slots designate the first slot of a channel. For 1 DPC (DIMM per channel) populate white slots only.
- The Intel Xeon E5-2620 processor does not support DIMMs at 1.35V. Using the HP RBSU, 1.35V DIMMs can be changed to operate at 1.5V.
- Depending on the memory configuration and processor model, the memory speed may run at 1866MHz, 1600MHz, 1333MHz or 1066MHz. See latest ProLiant QuickSpecs for processor models and supported memory speeds.
- 1866MHz and 1600MHz Low Voltage memory requires E5-2600 v2 series processors.
- Xeon E5-2600 v2 series processors require HP System ROM revision 09/08/2013 or newer. Revision 09/18/2013 or newer is required if using LRDIMMs.
Upgrade compatibili per i vostri sistemi
- Drive allo stato solido
Filtro
Filters
Applied
-
Numero di parte: SEDC600M/1920G
- Progettata appositamente per i data center
- Funzionalità PLP (Power loss protection) integrate
- Latenze e IOPS costanti e uniformi e QoS altamente affidabili
- Include Software di clonazione Acronis
- Fino a 560MB/s in lettura e 530MB/s in scrittura
- Numero di parte: SEDC600M/1920G
- Ulteriori informazioni
* Kit: la garanzia viene invalidata e i resi non vengono accettati nel caso in cui i componenti dei kit vengano venduti o utilizzati come parti separate.