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HP/HPE - ProLiant DL170h G6

configurator results memory

  • 표준

    6 GB (Removable)

  • 최대

    48 GB ECC UDIMM

    256 GB Reg ECC RDIMM

    384 GB 32GB QR Reg ECC RDIMM

  • CPU 1:

    2 GB
    2 GB
    2 GB

  • Optional CPU 2:

  • 버스 아키텍처

    PCI

    USB 2.0/3.x Type-A

    PCI-X

    PCI Express

    SSD - SATA 3.5-inch

스토리지 업그레이드 보기

  • 16 Socket(s)

  • Intel Xeon X5500 Series Intel 5520

503578-421; 503578-xx1; 503581-421; 503581-xx1

  • Reg ECC RDIMMs:

    Virtually any configuration up to 256GB can be reached using Kingston's 2, 4, 8 and 16GB single rank or dual rank RDIMM modules IN GROUPS OF THREE. A maximum 384GB can be reached using twelvel (12) 32GB quad rank RDIMM IN GROUPS OF THREE.

  • ECC UDIMMs:

    Virtually any configuration up to 48GB can be reached using Kingston's 1, 2 and 4GB modules IN GROUPS OF THREE.

중요 구성 노트

  • Kingston offers "K3" kit part numbers for Triple Channel mode.
  • Faster memory will clock down to run at optimal speed and voltage depending on processor model and number of modules installed.
  • Due to chipset limitations, Kingston's DDR3 Quad Rank memory will operate at 1066MHz in the first Triple Channel bank. Adding Quad Rank modules in the second Triple Channel bank will operate at 800MHz. The third memory bank must be unpopulated.
  • This system supports either Registered ECC or Unbuffered ECC memory. Mixing Registered ECC and Unbuffered ECC modules is not supported within this system.
  • Due to chipset limitations, Unbuffered ECC DIMMs are limited to TWO Triple Channel banks per processor on Intel Xeon 55xx series systems.
  • 4GB DDR3-1333 Reg ECC modules come in two versions: 313/4G using x4 and 3138/4G using x8 DRAM. The two parts may be installed in the same system but not within the same memory bank. Use like modules for dual and triple channel operation.

귀하의 시스템 호환 업그레이드

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* Kits: warranty void and returns not accepted if sold or used separately.