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AMD 3rd Generation EPYC Processor Platform “Milan”

The AMD 3rd Generation EPYC™ processor code-named “Milan” launched in 2021 under the 7003 series. This evolution of the Zen series microarchitecture brought significant improvements over previous generations, and featured up to 64 cores on package, support for eight DDR4 channels, and 128 PCIe 4.0 lanes. This is the first 7nm technology server microprocessor from AMD, with lower TDP, saving data center energy costs while providing the world’s highest performance per core and throughput.

Targeted Uses

  • Artificial Intelligence
  • HPC (High Performance Computing)
  • Next-generation Virtual Networks
  • Real-time Analytics
  • Mission Critical
Server memory

At A Glance

AMD 3rd Generation EPYC™ (Milan) 7003 Series

  • Supports up to 4TB (Terabytes) of memory per processor
  • Supports DDR4 Registered and Load Reduced DIMMs up to 3200MT/s, equivalent to transfer rates of 25.6GB/s per module{{Footnote.N67444}}

Memory Architecture

8 channels of memory

Memory architecture is based on Eight Channels arranged in Two Banks per processor. Each processor can be configured with 8 or 16 modules, depending on the motherboard layout, to achieve the maximum aggregated memory bandwidth.

  • 8 memory channels per processor
  • Up to 2 DIMMs per channel
  • Up to 16 DIMMs per processor
  • Up to 32 DIMMs per 2P server

AMD Population Rules

(8 Channel, 16 sockets per CPU, 2 DPC)

 
AMD EPYC™ (MILAN) 7003 SERIES
AMD EPYC™ (MILAN) 7003 SERIES.
 
AMD EPYC™ (MILAN) 7003 SERIES
AMD EPYC™ (MILAN) 7003 SERIES.
Module Type (No Mixing in a Server)
Module Type (No Mixing in a Server)
1 DIMM per Channel 1 DPC
2 DIMMs per Channel 2 DPC
Registered DIMM (RDIMM, 3DS)
Registered DIMM (RDIMM, 3DS)
3200{{Footnote.N67445}}
3200 (1R + 1R in 2 DPC) 2933 (2R in 2 DPC)
Load Reduced DIMM (LRDIMM, 3DS)
Load Reduced DIMM (LRDIMM, 3DS)
3200{{Footnote.N67445}}
2933 (4R in 2 DPC)
 
Module Type (No Mixing in a Server)
Registered DIMM (RDIMM, 3DS)
Load Reduced DIMM (LRDIMM, 3DS)
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