Acer - Altos BrainSphere T350 F4

configurator results memory

  • Máximo

    1 TB Reg ECC RDIMMs

    1 TB LRDIMMs

Actualizaciones de memoria compatibles

  • CPU 1:

  • CPU 2:

  • Arquitectura de bus

    USB 2.0/3.x Type-A

    PCI Express

    SSD - SATA 3.5-inch

    SSD M.2 NVME 2260 (double-sided)

    SSD M.2 NVME 2280 (double-sided)

    SSD M.2 NVME 22110 (double-sided)

Actualizaciones de Almacenamiento compatibles

  • 8 Socket(s) per CPU

    16 Socket(s) using two CPUs

  • Intel Xeon 1st/2nd Gen Scalable Intel C62x Series

Notas de configuración importantes

  • Only Intel Xeon x2xx Series (Cascade Lake-SP) processors can use memory modules built with 16Gb density DRAM. BIOS/firmware updates and/or specific board revisions may also be required.
  • Faster memory will clock down to run at optimal speeds depending on processor model installed.
  • Maximum memory bandwidth is achieved by upgrading in groups of six per CPU. Utilizing the additional sockets for increased capacity, also known as split-channels, will reduce aggregated memory bandwidth (GB/s).
  • Kingston offers both Registered RDIMM and Load Reduced LRDIMM memory modules. Registered and Load Reduced modules CANNOT be mixed within the same system.

Actualizaciones compatibles para su sistema

Resultados
Velocidad{{Footnote.A65242}}
Tipo de DIMM
Capacidad del módulo
Clasificación
DRAM Width
Densidad de DRAM
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Resultados
Rango de capacidad
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* Kits: la garantía quedará anulada y no se aceptarán devoluciones si las unidades dentro del kit se venden o usan de forma independiente.