适用于HP/HPE - ProLiant DL360 G6的内存

标准

4 GB (Removable)

6 GB (Removable)

12 GB (Removable)
最大

48 GB Using Qty-12 4GB ECC UDIMM

288 GB Using Qty-18 16GB Dual-Rank RDIMM

384 GB Using Qty-12 32GB Quad-Rank RDIMM

ECC UDIMM or Quad-Rank RDIMM:

CPU 1

CPU 2

Reg ECC RDIMM:

CPU 1

CPU 2

总线架构

PCI

USB 2.0/3.x Type-A

PCI-X

PCI Express

SSD - SATA 2.5-inch 9.5mm

兼容的存储升级产品

18 Socket(s) maximum using RDIMMs

12 Socket(s) maximum using UDIMMs or QR RDIMMs

Intel Xeon 5500 Series Intel 5520

Intel Xeon 5600 Series Intel 5520

470065-073; 470065-074; 470065-075; 470065-087; 470065-105; 470065-119; 470065-156; 470065-158; 470065-181; 470065-206; 470065-233; 470065-236; 484184-B21; 504633-421; 504633-xx1; 504634-421; 504634-xx1; 504635-421; 504635-xx1; 504636-421; 504636-xx1; 504637-421; 504637-xx1; 504637R-421; 519568-425; AY489A

Kingston offers "K3" kit part numbers for Triple Channel mode. For optimum dual or triple channel configurations, use like modules within the same memory bank. Do not mix single, dual or quad rank modules, varying capacities or speeds.
Faster memory will clock down to run at optimal speed and voltage depending on processor model and number of modules installed.
Due to chipset limitations, Kingston's DDR3 Quad Rank memory will operate at 1066MHz in the first Triple Channel bank. Adding Quad Rank modules in the second Triple Channel bank will operate at 800MHz. The third memory bank must be unpopulated.

Due to chipset limitations, Unbuffered ECC DIMMs are limited to TWO Triple Channel banks per processor on Intel Xeon 55xx series systems.
This system supports either Registered ECC or Unbuffered ECC memory. Mixing Registered ECC and Unbuffered ECC modules is not supported within this system.
Low Voltage DIMMs (KTH-PL313LV) can run at 1.35V with Intel Xeon 5600 series processors, but will also run at 1.5V using Xeon 5500 series processors.