Embedded/Industrial

Embedded Discrete DRAM for Device Manufacturers

Kingston Embedded Discrete DRAM is designed to meet the needs of embedded devices and are available with low- voltage variants for reduced power consumption. Kingston Embedded Discrete DRAM is powering a variety of modern electronic infrastructures such as smart cities (HVAC, lighting, power monitoring and metering parking meters), industrial (robotics, IoT, factory automation, single board computers), telecommunications (5G networking, edge computing, communication models, WiFi routers mesh devices), and devices such as smart home (sound bars, thermostats, fitness equipment, vacuums, beds, and faucets), and wearables (smart watches, health monitors, fitness trackers, AR, VR).

KEY FEATURES

  • Double Data Rate (DDR) architecture: two data transfers per clock cycle
  • High-speed data transfer is realized by 8 bits prefetch pipelined architecture
  • Bi-directional differential data strobe (DOS and /DQS) is transmitted/received with data for capturing data at the receiver
  • DOS is edge-aligned with data for READS; center-aligned with data for WRITES
  • Differential clock inputs (CK and /CK)
  • DLL aligns DQ and DOS transitions with CK transitions
  • Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS to both edges of DQS
  • Data Mask (DM) for write data
  • Posted /CAS by programmable additive latency for better command and data bus efficiency
  • On-Die Termination (ODD for better signal quality)
    • Synchronous ODT
    • Dynamic CDT
    • Asynchronous ODT
  • Multi-Purpose Register (MPR) for pre-defined pattern read out
  • ZQ calibration for DO drive and ODT
  • Programmable Partial Array Self-Refresh (PASR)
  • RESET pin for power-up sequence and reset function
  • SRT range: normal/extended
  • Programmable output driver impedance control

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Standard Part Numbers and Specifications

DDR3/DDR3L FBGA Commercial Temp

Part NumberCapacityDescriptionPackageVDD,
VDDQ
Operating
Temperature
D1216ECMDXGJD 2Gb 96 ball 128Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} 0°C ~ +95°C
D2516ECMDXGJD 4Gb 96 ball 256Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} 0°C ~ +95°C
D5128ECMDPGJD 4Gb 78 ball 512Mx8 DDR3/3L 1866Mbps 7.5x10.6x1.2 1.35V{{Footnote.N64253}} 0°C ~ +95°C
D2516ECMDXGME 4Gb 96 ball 256Mx16 DDR3/3L 2133Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} 0°C ~ +95°C
B5116ECMDXGJD 8Gb 96 ball 512Mx16 DDR3/3L 1866Mbps 9x13.5x1.2 1.35V{{Footnote.N64253}} 0°C ~ +95°C

DDR3/DDR3L FBGA Industrial Temp

Part NumberCapacityDescriptionPackageVDD,
VDDQ
Operating
Temperature
D1216ECMDXGJDI 2Gb 96 ball 128Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C
D2568ECMDPGJDI 2Gb 78 ball 256Mx8 DDR3/3L 1866Mbps 7.5x10.6x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C
D2516ECMDXGJDI 4Gb 96 ball 256Mx16 DDR3/3L 1866Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C
D5128ECMDPGJDI 4Gb 78 ball 512Mx8 DDR3/3L 1866Mbps 7.5x10.6x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C
D2516ECMDXGMEI 4Gb 96 ball 256Mx16 DDR3/3L 2133Mbps 7.5x13.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C
B5116ECMDXGJDI 8Gb 96 ball 512Mx16 DDR3/3L 1866Mbps 9x13.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +95°C

DDR3/DDR3L FBGA Automotive Temp

Part NumberCapacityDescriptionPackageVDD,
VDDQ
Operating
Temperature
D1216ECMDXGMEY 2Gb 96 ball 128Mx16 DDR3/3L 2133Mbps 13.5x7.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +105°C
D2516ECMDXGMEY 4Gb 96 ball 256Mx16 DDR3/3L 2133Mbps 13.5x7.5x1.2 1.35V{{Footnote.N64253}} -40°C ~ +105°C

DDR4 FBGA Commercial Temp

Part NumberCapacityDescriptionPackageVDD,
VDDQ
Operating
Temperature
D5116AN9CXGRK 8Gb 96 ball FBGA DDR4 C-Temp 7.5x13x1.2 1.2V 0°C ~ +95°C
D5116AN9CXGXN 8Gb 96 ball FBGA DDR4 C-Temp 7.5x13x1.2 1.2V 0°C ~ +95°C
D2516ACXGXGRK 4Gb 96 ball FBGA DDR4 C-Temp 7.5x13x1.2 1.2V 0°C ~ +95°C

DDR4 FBGA Industrial Temp

Part NumberCapacityDescriptionPackageVDD,
VDDQ
Operating
Temperature
D5116AN9CXGXNI 8Gb 96 ball FBGA DDR4 I-Temp x16 7.5x13x1.2 1.2V -40°C ~ +95°C
D1028AN9CPGXNI 8Gb 78 ball FBGA DDR4 I-Temp x8 7.5x13x1.2 1.2V -40°C ~ +95°C

LPDDR4 FBGA Commercial Temp

Part NumberCapacityDescriptionPackageVDD,
VDDQ
Operating
Temperature
D0811PM2FDGUK 8Gb 200 ball FBGA LPDDR4 C-Temp 10x14.5x1.0 1.1V -25°C ~ +85°C
B1621PM2FDGUK 16Gb 200 ball FBGA LPDDR4 C-Temp 10x14.5x1.0 1.1V -25°C ~ +85°C

LPDDR4 FBGA Industrial Temp

Part NumberCapacityDescriptionPackageVDD,
VDDQ
Operating
Temperature
D0811PM2FDGUKW 8Gb 200 ball FBGA LPDDR4 I-Temp 10x14.5x1.0 1.1V -40°C ~ +95°C
B1621PM2FDGUKW 16Gb 200 ball FBGA LPDDR4 I-Temp 10x14.5x1.0 1.1V -40°C ~ +95°C