Embedded/Industrial

Embedded Discrete DRAM for device manufacturers

Kingston Embedded Discrete DRAM is designed to meet the needs of embedded devices and is available with low- voltage variants for reduced power consumption. Kingston Embedded Discrete DRAM is powering a variety of modern electronic infrastructures such as smart cities (HVAC, lighting, power monitoring and parking meters), industrial (robotics, IoT, factory automation, single-board computers) and telecommunications (5G networking, edge computing, communication models, Wi-Fi routers mesh devices), and devices such as smart home (sound bars, thermostats, fitness equipment, vacuums, beds and taps) and wearables (smart watches, health monitors, fitness trackers, AR, VR).

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KEY FEATURES

Double Data Rate (DDR) architecture: two data transfers per clock cycle
High-speed data transfer is realised by 8 bits prefetch pipelined architecture
Bi-directional differential data strobe (DOS and /DQS) is transmitted/received
DOS is edge-aligned with data for READS; centre-aligned with data for WRITES
Differential clock inputs (CK and /CK)
DLL aligns DQ and DOS transitions with CK transitions
Commands entered on each positive CK edge; data and data mask referenced
Data Mask (DM) for write data
Posted /CAS by programmable additive latency for better command and data
On-Die Termination (ODD) for better signal quality
- Synchronous ODT
- Dynamic CDT
- Asynchronous ODT
Multi-Purpose Register (MPR) for pre-defined pattern read out
ZQ calibration for DO drive and ODT
Programmable Partial Array Self-Refresh (PASR)
RESET pin for power-up sequence and reset function
SRT range: normal/extended
Programmable output driver impedance control

Standard part numbers and specifications

DDR3/DDR3L FBGA Commercial Temp

Part number	Capacity	Description	Package	VDD, VDDQ	Operating temperature
D1216ECMDXGJD	2Gb	96 ball 128Mx16 DDR3/3L 1866Mbps	7.5x13.5x1.2	1.35V{{Footnote.N64253}}	0°C ~ +95°C
D2516ECMDXGJD	4Gb	96 ball 256Mx16 DDR3/3L 1866Mbps	7.5x13.5x1.2	1.35V{{Footnote.N64253}}	0°C ~ +95°C
D5128ECMDPGJD	4Gb	78 ball 512Mx8 DDR3/3L 1866Mbps	7.5x10.6x1.2	1.35V{{Footnote.N64253}}	0°C ~ +95°C
D2516ECMDXGME	4Gb	96 ball 256Mx16 DDR3/3L 2133Mbps	7.5x13.5x1.2	1.35V{{Footnote.N64253}}	0°C ~ +95°C
B5116ECMDXGJD	8Gb	96 ball 512Mx16 DDR3/3L 1866Mbps	9x13.5x1.2	1.35V{{Footnote.N64253}}	0°C ~ +95°C

DDR3/DDR3L FBGA Industrial Temp

Part number	Capacity	Description	Package	VDD, VDDQ	Operating temperature
D1216ECMDXGJDI	2Gb	96 ball 128Mx16 DDR3/3L 1866Mbps	7.5x13.5x1.2	1.35V{{Footnote.N64253}}	-40°C ~ +95°C
D2568ECMDPGJDI	2Gb	78 ball 256Mx8 DDR3/3L 1866Mbps	7.5x10.6x1.2	1.35V{{Footnote.N64253}}	-40°C ~ +95°C
D2516ECMDXGJDI	4Gb	96 ball 256Mx16 DDR3/3L 1866Mbps	7.5x13.5x1.2	1.35V{{Footnote.N64253}}	-40°C ~ +95°C
D5128ECMDPGJDI	4Gb	78 ball 512Mx8 DDR3/3L 1866Mbps	7.5x10.6x1.2	1.35V{{Footnote.N64253}}	-40°C ~ +95°C
D2516ECMDXGMEI	4Gb	96 ball 256Mx16 DDR3/3L 2133Mbps	7.5x13.5x1.2	1.35V{{Footnote.N64253}}	-40°C ~ +95°C
B5116ECMDXGJDI	8Gb	96 ball 512Mx16 DDR3/3L 1866Mbps	9x13.5x1.2	1.35V{{Footnote.N64253}}	-40°C ~ +95°C

DDR3/DDR3L FBGA Automotive Temp

Part number	Capacity	Description	Package	VDD, VDDQ	Operating temperature
D1216ECMDXGMEY	2Gb	96-ball 128Mx16 DDR3/3L 2133Mbps	13.5x7.5x1.2	1.35V{{Footnote.N64253}}	-40°C ~ +105°C
D2516ECMDXGMEY	4Gb	96-ball 256Mx16 DDR3/3L 2133Mbps	13.5x7.5x1.2	1.35V{{Footnote.N64253}}	-40°C ~ +105°C

DDR4 FBGA Commercial Temp

Part number	Capacity	Description	Package	VDD, VDDQ	Operating temperature
D5116AN9CXGRK	8Gb	96 ball FBGA DDR4 C-Temp	7.5x13x1.2	1.2V	0°C ~ +95°C
D5116AN9CXGXN	8Gb	96 ball FBGA DDR4 C-Temp	7.5x13x1.2	1.2V	0°C ~ +95°C
D2516ACXGXGRK	4Gb	96 ball FBGA DDR4 C-Temp	7.5x13x1.2	1.2V	0°C ~ +95°C

DDR4 FBGA Industrial Temp

Part number	Capacity	Description	Package	VDD, VDDQ	Operating temperature
D5116AN9CXGXNI	8Gb	96 ball FBGA DDR4 I-Temp x16	7.5x13x1.2	1.2V	-40°C ~ +95°C
D1028AN9CPGXNI	8Gb	78 ball FBGA DDR4 I-Temp x8	7.5x13x1.2	1.2V	-40°C ~ +95°C

LPDDR4 FBGA Commercial Temp

Part Number	Capacity	Description	Package	VDD, VDDQ	Operating Temperature
D0811PM2FDGUK	8Gb	200 ball FBGA LPDDR4 C-Temp	10x14.5x1.0	1.1V	-25°C ~ +85°C
B1621PM2FDGUK	16Gb	200 ball FBGA LPDDR4 C-Temp	10x14.5x1.0	1.1V	-25°C ~ +85°C

LPDDR4 FBGA Industrial Temp

Part Number	Capacity	Description	Package	VDD, VDDQ	Operating Temperature
D0811PM2FDGUKW	8Gb	200 ball FBGA LPDDR4 I-Temp	10x14.5x1.0	1.1V	-40°C ~ +95°C
B1621PM2FDGUKW	16Gb	200 ball FBGA LPDDR4 I-Temp	10x14.5x1.0	1.1V	-40°C ~ +95°C