Embedded DRAM Components for device manufacturers
Kingston DRAM components are designed to meet the needs of embedded devices and are available with low- voltage variants for reduced power consumption.
Standard part numbers and specifications
DDR3/DDR3L FBGA Commercial Temp
Part number | Capacity | Description | Package | VDD, VDDQ | Operating temperature |
---|---|---|---|---|---|
D1216ECMDXGJD | 2Gb | 96 ball 128Mx16 DDR3/3L 1866Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | 0°C ~ +95°C |
D2516ECMDXGJD | 4Gb | 96 ball 256Mx16 DDR3/3L 1866Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | 0°C ~ +95°C |
D5128ECMDPGJD | 4Gb | 78 ball 512Mx8 DDR3/3L 1866Mbps | 7.5x10.6x1.2 | 1.35V{{Footnote.N64253}} | 0°C ~ +95°C |
D2516ECMDXGME | 4Gb | 96 ball 256Mx16 DDR3/3L 2133Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | 0°C ~ +95°C |
B5116ECMDXGJD | 8Gb | 96 ball 512Mx16 DDR3/3L 1866Mbps | 9x13.5x1.2 | 1.35V{{Footnote.N64253}} | 0°C ~ +95°C |
DDR3/DDR3L FBGA Industrial Temp
Part number | Capacity | Description | Package | VDD, VDDQ | Operating temperature |
---|---|---|---|---|---|
D1216ECMDXGJDI | 2Gb | 96 ball 128Mx16 DDR3/3L 1866Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
D2568ECMDPGJDI | 2Gb | 78 ball 256Mx8 DDR3/3L 1866Mbps | 7.5x10.6x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
D2516ECMDXGJDI | 4Gb | 96 ball 256Mx16 DDR3/3L 1866Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
D5128ECMDPGJDI | 4Gb | 78 ball 512Mx8 DDR3/3L 1866Mbps | 7.5x10.6x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
D2516ECMDXGMEI | 4Gb | 96 ball 256Mx16 DDR3/3L 2133Mbps | 7.5x13.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
B5116ECMDXGJDI | 8Gb | 96 ball 512Mx16 DDR3/3L 1866Mbps | 9x13.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +95°C |
DDR3/DDR3L FBGA Automotive Temp
Part number | Capacity | Description | Package | VDD, VDDQ | Operating temperature |
---|---|---|---|---|---|
D1216ECMDXGMEY | 2Gb | 96-ball 128Mx16 DDR3/3L 2133Mbps | 13.5x7.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +105°C |
D2516ECMDXGMEY | 4Gb | 96-ball 256Mx16 DDR3/3L 2133Mbps | 13.5x7.5x1.2 | 1.35V{{Footnote.N64253}} | -40°C ~ +105°C |
DDR4 FBGA Commercial Temp
Part number | Capacity | Description | Package | VDD, VDDQ | Operating temperature |
---|---|---|---|---|---|
D5116AN9CXGRK | 8Gb | 96 ball FBGA DDR4 C-Temp | 7.5x13x1.2 | 1.2V | 0°C ~ +95°C |
D5116AN9CXGXN | 8Gb | 96 ball FBGA DDR4 C-Temp | 7.5x13x1.2 | 1.2V | 0°C ~ +95°C |
D2516ACXGXGRK | 4Gb | 96 ball FBGA DDR4 C-Temp | 7.5x13x1.2 | 1.2V | 0°C ~ +95°C |
DDR4 FBGA Industrial Temp
Part number | Capacity | Description | Package | VDD, VDDQ | Operating temperature |
---|---|---|---|---|---|
D5116AN9CXGXNI | 8Gb | 96 ball FBGA DDR4 I-Temp x16 | 7.5x13x1.2 | 1.2V | -40°C ~ +95°C |
D1028AN9CPGXNI | 8Gb | 78 ball FBGA DDR4 I-Temp x8 | 7.5x13x1.2 | 1.2V | -40°C ~ +95°C |
LPDDR4 FBGA Commercial Temp
Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
---|---|---|---|---|---|
D0811PM2FDGUK | 8Gb | 200 ball FBGA LPDDR4 C-Temp | 10x14.5x1.0 | 1.1V | -25°C ~ +85°C |
B1621PM2FDGUK | 16Gb | 200 ball FBGA LPDDR4 C-Temp | 10x14.5x1.0 | 1.1V | -25°C ~ +85°C |
LPDDR4 FBGA Industrial Temp
Part Number | Capacity | Description | Package | VDD, VDDQ | Operating Temperature |
---|---|---|---|---|---|
D0811PM2FDGUKW | 8Gb | 200 ball FBGA LPDDR4 I-Temp | 10x14.5x1.0 | 1.1V | -40°C ~ +95°C |
B1621PM2FDGUKW | 16Gb | 200 ball FBGA LPDDR4 I-Temp | 10x14.5x1.0 | 1.1V | -40°C ~ +95°C |