O que é uma CAMM?

CAMM modules were created to address specific challenges for computer manufacturers. Since the introduction of the first Intel Ultrabook^™ design, the Apple MacBook Air in 2011, manufacturers have struggled with memory and other components squeezing into a thin profile form factor. Traditional SODIMMs (Small Outline Dual In-line Memory Module) proved to be too thick to fit into this class of systems, with the SODIMM socket having specific height requirements that couldn’t be accommodated in the Ultrabook. This forced computer manufacturers to use discrete DRAM (aka DRAM down) surface mounted directly to the motherboard. In manufacturing, there are many downsides to this approach. For example, if one DRAM component failed during testing, the entire motherboard would need to be reworked for the DRAM to be removed and replaced (versus simply swapping out a module on the production line). As chip prices and availability tend to fluctuate with the memory market, manufacturers also struggle to plan for the most cost-effective memory type for their systems.

Computer builders like Dell need flexibility in manufacturing and component cost to offer systems at the right price point for their customers. They also need to adjust quickly to changing market conditions. Traditionally they've done this with memory. When there are shortages and memory is expensive, they reduce the build cost of their system by lowering the amount of memory they install. With DRAM down, that's much harder to do, let alone plan for. Both DDR DRAM and LPDDR DRAM are supported by laptop processors, so choosing a higher-priced memory component can ultimately affect the end-cost of the system. Upgradeability is also a challenge and is usually ruled out for this class of system since DRAM chips cannot be simply added to the motherboard by a user or system integrator.